Capacitive Fingerprint Module On the Back of the Phone

See Larger Picture : Capacitive Fingerprint Module On the Back of the Phone

Company Name:SunWin HuBei Optoelectronic Technology Co.,Ltd
Membership:Free Member
Member Since:2022. 09.14
Country/Region:China
City:湖北
Contact:James Pan
Related Keywords:Fingerprint Module On the

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US$ 1.13

Min Order Quantity	1000 Piece

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SunWin HuBei Optoelectronic Technology Co.,Ltd
[China]

Address: 108 Xianning 湖北

Phone: 86-183-00675328

Contact name: James Pan

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Place of Origin: China
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Description

Structure: Coating Package size: 10 thickness 0.65mm Induction type: capacitance principle press type Sensing area: 6.0*6.0 Cold screen unlock: <0.15S Pixel array: 120*120 Dividing rate: 508DPI FRRFAR FRR: <2% FAR: <0.002% Power consumption: black screen standby <250u6 Surface hardness: 3H Number of presses: 1 million times Function: Unlock/Wake up when closing the screen Minimum module size: 13*13mm

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