Capacitive Bag Type Fingerprint Module
- Company Name:SunWin HuBei Optoelectronic Technology Co.,Ltd
- Membership:Free Member
- Member Since:2022. 09.14
- Country/Region:China
- City:湖北
- Contact:James Pan
- Related Keywords:Fingerprint Module
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SunWin HuBei Optoelectronic Technology Co.,Ltd
[China]
Structure: Coating Package size: 3.2-6.4mm T=0.65mm Induction type: Capacitive press type Sensing area: 3.6*3.2mm Cold screen unlock: <40ms Pixel array: 72*64 Resolution: 508 DPI FRR/FAR |FRR:<1/100 FAR:<1/50000 Power consumption: black screen standby <15uA Surface hardness: ≧4H Pressing times:> 1 million times Function: Unlock/Wake up on cold screen
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